Renesas H8S/2214 Series User Manual download pdf (Page 11)

CAUTION

1. Never dip the IC socket in flux or use wash to clean the IC

socket. This is because flux may remain inside the IC

socket due to the IC socket’s structure. When using the

IC socket with other DIP products, never clean the other

DIP products with flux because the flux may enter the

connector through the guide pins of the IC socket.

2. When an IC socket with guide pins is soldered to the

user system, about 1.4 mm of the guide pins will stick out

(when the user-system board is 1.6 mm thick). When a

load is applied to the guide pins from the back of the

user-system board, stress will be applied to the soldered

part of the IC socket, and this may destroy the

connectors. Do not apply any load to the guide pins after

the IC socket has been soldered on the user system.

3. When an IC socket with no guide pins is soldered to the

user system, the soldered part will crack if stress is

applied to the IC socket. Therefore, always apply

adhesive to the connector and the user system so that

there is a firm connection between them.

4. When the IC socket has guide pins, it is recommended

that epoxy resin adhesive or solder be applied to the

guide pins at the back of the user system to make sure

that no stress is applied to the soldered part

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Renesas H8S/2214 Series User Manual Page 11