Renesas H8S/2214 Series User Manual download pdf (Page 10)

(4) Notes on soldering the IC socket

a) The IC socket is larger than the actual IC package; therefore, refer to figure 7 for the

installation of other components.

b) Do not install components that occupy large volume close to the IC socket. Such

components will prevent the convective flow of heat during reflow.

c) Since the IC socket has a greater volume than the IC package, it is recommended that the

temperature profile under the conditions used in installation be measured by attaching a

temperature sensor to the back side of the IC socket.

d) Under the reflow conditions for soldering the IC socket, specify the actual heating to

more than 210°C for 30 to 60 seconds.

Recommended Reflow Conditions

Surface temperature of IC-socket connector

Preheating: 150 to 180°C for 180 seconds

Actual heating: To more than 210°C, for 30 to 60

seconds

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Renesas H8S/2214 Series User Manual Page 10